One of the biggest challenges SMT assemblers are facing is the need to control the quality of a printing process. More than 70% of the assembly failures are rooted in this critical production- phase. When dealing with complex PCBs containing a large number of micro BGA and ultra-small chip components, or those based on a wide use of step stencils, flexible panels, etc – the challenge intensifies. If you wish to avoid potential failure opportunities, such as shorts between adjacent pads, or variance of solder paste volume, you must first optimize the process parameters, but it needs to be followed by a well reliable process control method. You need to get the right amounts of solder paste, but also make sure it is repeatable and statistically stable.
The best method of solder paste inspection is to be able to use the SPI results for a rebalance of the process. That way you can improve all the time. Solder paste is a mixture of powdered metal particles spheres held within a flux paste base. There are numerous solder paste materials you can choose from. Using the correct type of solder paste is usually based on your customer needs and industry definitions, but the optimization and the reduction of failure opportunities come from experience and knowledge. International Electronics is well-known for its pioneering approach when it comes to trying new methods, and materials aiming for the best results in the shortest possible time.
